Intel’s next-gen processor

November 13, 2008

Intel’s next generation processor may be launched in November itself, hinted Suryanarayanan B, Director (South), Sales and Marketing Group, Intel South Asia. The Intel’s next generation processor, codenamed Bloomfield, is based on a completely new microarchitecture called Nehalem.

The Nehalem microarchitecture, is said to be an extremely energy efficient design. Developers have introduced the turbo mode and dynamic power management and hyper-threading technology. Intel has already pointed out during the Intel Developer Forum (IDF), TAIPEI that it has a 32nm version of the Nehalem, which should be out soon.

The new processor is expected to facilitate a huge performance increase, almost 2X, with Nehalem.

Suryanarayanan B, said on the sidelines of the Intel Channel Conference in Banganalore that Intel had made concrete efforts in launching environmentally-friendly products during 2008 and has started organizing channel conferences in 150 cites and towns in India.

He said that on the design side, Intel’s products are created to minimize environmental impact. “We continue to dramatically increase the energy efficiency of our products and incorporate more environmentally sensitive materials into our design process”, he said.

He added that the Intel Core 2 Duo processors for desktops consume up to 40 percent less energy and are 40 percent faster than previous generations.

Intel’s breakthrough 45nm Hi-k silicon technology delivers greater energy efficiency then previous generations. Intel’s newest 45nm processors are manufactured using lead-free technology today and halogen-free packaging technology. The transition to lead and halogen free is important because these materials can potentially have adverse affects to the environment if not properly recycled, Suryanarayanan pointed out.

According to the director, Intel introduced halogen-free packaging technology for its processor and chipset products starting in 2008, and will convert most of its 45nm processor and 65nm chipset products to halogen-free packaging technology by the end of 2008.